DIP PROCESS · 03
DIP Assembly & Soldering
Through-hole insertion, soldering and process confirmation within the manufacturing delivery flow.THROUGH-HOLE ASSEMBLY
DIP assembly integrates insertion, dispensing, wave soldering and process confirmation for through-hole and odd-form components.
Automated insertion equipment, visual dispensing systems and lead-free wave-soldering equipment are selected according to component geometry, material behavior and takt time.
The process is designed to connect smoothly with upstream placement and downstream inspection, maintaining controlled handling, solder-joint quality and traceable production records.