Liuhe Electronics SMT workshop

SMT PROCESS · 02

SMT Placement

Automated placement, process parameters and in-process inspection across the SMT workflow.

SURFACE MOUNT TECHNOLOGY

Automated SMT placement is managed as a connected process from solder-paste printing to first-article confirmation.

Printing, SPI, high-speed placement, reflow soldering and AOI inspection are linked by controlled parameters and process records.

The line is configured for both recurring volume programs and high-mix, small-batch requirements, with first-article review and in-process confirmation supporting stable release.

01Solder-paste printing
02SPI measurement and feedback
03Component recognition and placement
04Reflow profile control
05AOI inspection
06First-article confirmation